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Northeast Japan Earthquake Influence on Semiconductor Equipment Manufacturing Vol.16 (Final)

Screen to Enter Market for Semiconductor Wafer Pattern Inspection System

SOKUDO DUO sets productivity world record and >350wph throughput target


   
20. November 2008


Dainippon Screen Mfg. Co., Ltd. has recently developed the world’s first drying technology for use in 300-mm wafer semiconductor device production lines that does not require IPA (isopropyl alcohol).

Sales of FC-3100 batch cleaning equipment (wet stations) featuring a module known as the Dry-Air Dryer (DAD) that uses this new drying technology will commence in December 2008.

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