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Achieving Increased Yield in Next-generation Semiconductor Devices through Optimization of Cleaning Droplet Energy.

Dainippon Screen Mfg. Co., Ltd., announced today that it has successfully developed the NanosprayÅ (Nanospray Advance), the world’s first* spray cleaning system capable of cleaning wafers without damaging the ultrafine circuit patterns used in nextgeneration semiconductors.

 

	Conventional droplets		NanosprayÅ droplets

Recent semiconductor industry trends towards further circuit miniaturization and multilayered wiring have made the establishment of process technologies for next-generation 32-nanometer semiconductors and future processes an urgent task. In particular, with wafer cleaning processes accounting for a large part of the semiconductor manufacturing process as a whole, the issue of preventing circuit pattern collapse during cleaning is a significant one and there is great demand for systems with new cleaning functions capable of handling an ever diversifying range of materials as well as ultrafine circuit patterns.

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