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Northeast Japan Earthquake Influence on Semiconductor Equipment Manufacturing Vol.16 (Final)

Screen to Enter Market for Semiconductor Wafer Pattern Inspection System

SOKUDO DUO sets productivity world record and >350wph throughput target


   
Oktober 2008

Development of new wafer edge etching and cleaning technology

The Semiconductor Equipment Company of Dainippon Screen Mfg. Co., Ltd. has recently developed a new type of technology called the Bevel Etching Chamber (BEC) that makes it possible to remove metallic film deposited on the...[weiterlesen...]


Dainippon Screen Launches New Corporate Vision

Dainippon Screen Mfg. Co., Ltd., has launched a brand-new corporate vision. The new vision reflects the Screen Group’s aim of being a company that is able to share the future with its stakeholders while continuing to offer them...[weiterlesen...]


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